Additive Manufacturing for Whey Protein Microcarriers
Lynch, Thomas
Lynch, Thomas
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Abstract
Introduction: Electrospraying has emerged as a versatile electrohydrodynamic technique for producing uniform micro- and nanoscale particles for encapsulation applications. Whey proteins represent an attractive electrospray material due to their biocompatibility, film-forming capability, and ability to form structurally stable matrices. This study investigates the electrodripping behavior of whey protein solutions with the objective of producing microcarrier suitable for high-throughput manufacturing processes, focusing on the relationship between solution rheology and electrohydrodynamic jet stability. Materials and Methods: Whey protein solutions were prepared across a range of concentrations to systematically vary viscosity and evaluate its influence on electrospray regimes. Rheological characterization was performed to quantify viscosity and assess flow behavior. Electrodripping experiments were conducted under controlled voltage, flow rate, and collection conditions to generate charged droplets that rapidly solidify into protein microcarriers. Results and Discussion: Preliminary observations indicate that solution viscosity strongly governs jet stability and particle formation. An intermediate viscosity range appears to promote stable cone-jet operation, enabling consistent droplet formation and improved particle uniformity. Rheological datasets collected for each formulation provide quantitative insight into the processing window required for controlled microcarrier formation. These viscosity measurements are currently being correlated with particle morphology and size distribution through ongoing microcarrier collection and characterization. Conclusion: The resulting dataset will enable structure-property relationships to be established between whey protein solution rheology, electrospray stability, and final microcarrier architecture. Together, these findings aim to inform the design of whey protein electrodripping systems capable of reliable, scalable microencapsulation for applications in food engineering, biomaterials, and pharmaceutical delivery.
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Date
1/1/2026
Student Status
Senior (Graduating in 2026)
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Poster
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Program/Major
Biomedical Engineering
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College of Engineering and Mathematical Sciences
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Engineering