Production of SAW devices on LiNbO3 using bi-layer liftoff lithography
Abstract
Surface acoustic wave (SAW) devices leverage properties of piezoelectric materials to excite mechanical waves, which can be used in applications such as radiofrequency filters, harmonic transponders, and acoustic signal processing. These devices use interdigitated transducers of alternating voltage polarity placed on top of the substrate with dimensions impacting the behavior of the completed device. This work aims to develop a standard process flow for efficient and accurate production of SAW devices using tooling present at UVM. The process flow will allow for production of devices to study In2 Se3 acoustoelectrics, and enable future research surrounding SAW devices at UVM.
Primary Faculty Mentor Name
Jackson Anderson
Status
Undergraduate
Student College
College of Engineering and Mathematical Sciences
Program/Major
Electrical Engineering
Primary Research Category
Engineering and Math Science
Production of SAW devices on LiNbO3 using bi-layer liftoff lithography
Surface acoustic wave (SAW) devices leverage properties of piezoelectric materials to excite mechanical waves, which can be used in applications such as radiofrequency filters, harmonic transponders, and acoustic signal processing. These devices use interdigitated transducers of alternating voltage polarity placed on top of the substrate with dimensions impacting the behavior of the completed device. This work aims to develop a standard process flow for efficient and accurate production of SAW devices using tooling present at UVM. The process flow will allow for production of devices to study In2 Se3 acoustoelectrics, and enable future research surrounding SAW devices at UVM.
